Flip Chip Jetting / Dipping flux
2025-06-24
| Flux Type | Flux Type | Flux Application Method | Description | Target Application | Cleaning Method | Halogen Contain | Material |
| Flip-Chip Flux | WS | Spraying / Jetting | Flux sprayed onto substrate for flip-chip attach | 165micron pitch SnAg onto SOP for multicore logic flip-chip die | Cleanable with warm DI water only | Zero | WF-710 |
| Flip-Chip Flux | WS | Dipping | Flux applied to the solder bumps on a flip-chip by dipping | Eliminates voiding from probe-test indents in flipchip bumps | Cleanable with warm DI water only | Zero | PF-709D PF-709AD |
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Flip Chip Jetting / Dipping flux
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