Wafer plating liquid flux
2025-06-24
| Flux Type | Flux Type | Flux Application Method | Description | Target Application | Cleaning Method | Halogen Contain | Material |
| Wafer Bumping Flux | NC | Spin coating | Liquid flux for reflow of solder bumps on UBM | High Pb; Eutectic (63Sn/37Pb); SnAg | Solvent or aqueous based chemistry | Zero | WF-335C |
| Wafer Bumping Flux | WS | Spin coating | Liquid flux for reflow of solder bumps on UBM | SnAg /SnAgCu solder bumps | Cleanable with warm DI water only | Zero | WF-710 WF-711 |
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Wafer plating liquid flux
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