Water Soluble Solder Paste
2025-06-24
| Flux Type | Flux Type | Flux Application Method | Description | Target Application | Cleaning Method | Halogen Contain | Material |
| Solder paste | WS | Jetting | Jet onto substrate for flip-chip attach | SiP Lead Free Metal Alloy, Type 4/5/6 | Cleanable with warm DI water only | Zero | 717J |
| Solder paste | WS | Dipping | Solder paste applied to the solder bumps on a flip-chip by dipping | SiP Lead Free Metal Alloy, Type 5/6 | Cleanable with warm DI water only | Zero | 718D |
| Solder paste | WS | Printing | Solder paste applied to the substrate by printing | SiP Lead Free Metal Alloy, Type 3/4/5/6 | Cleanable with warm DI water only | Zero HF | 798LF 787LV 711LS |
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Water Soluble Solder Paste
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